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CTG-D30PS

■ CTG-D30PS 導熱軟墊 , 特別適合填補於發熱體與外殼(或散熱模組)之間的機構間距做熱移轉介面,有效解決系統蓄熱問題並提升系統工作效能。 

◆中階導熱率                
◆高壓縮柔軟度                  
◆吸附性極佳                        
◆低出油率

Physical Properties Unit Product Number Test Method
CTG-D30PS
顏色
Color
Gray Visual
厚度範圍
Thickness Range
mm 1~10 ASTM D374
導熱係數
Thermal Conductivity
W/m.K 3 ASTM D5470
硬度
Hardness
Shore 00 30 ASTM D2240
比重
Specific Gravity
g/cm³ 2.2 ASTM D792
伸張度
Elongation
% 75 ASTM D412
抗拉強度
Tensile Strength
Kgf/cm² 2.5 ASTM D412
重量損失
Weight Loss
% < 1 200/24hrs
體積阻抗
Volume Resistance
Ohm.cm 10¹¹ ASTM D257
操作溫度範圍
Operating Temperature Range
-40 to 200
耐電壓
Dielectric Breakdown Voltage
KV/mm 3 ASTM D149
阻燃性
Flame Resistance
V-0 UL-94
The physical properties listed above are for reference only and the actual delivery product is confirmed by the approved sample attached to the approval sheet.