導熱膠墊(填縫)
■ CTG-導熱膠墊
可選用此系列的適當品號和厚度做夾縫填補 , 將發熱體的熱移轉到金屬板擴散或直接經由外殼散熱於殼外.
可選用此系列的適當品號和厚度做夾縫填補 , 將發熱體的熱移轉到金屬板擴散或直接經由外殼散熱於殼外.
| Product Number (CTG-series) / Unit |
D130RG | D110LM | D80LM | D60LS | D45RS | D32LS | 測試方法 Test Method |
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| Color (顏色) |
Gray | Lt. Green gray | Lt. Purple gray | Peach-Red gray | Green-gray | Mud- Gray | Visual |
| Thickness Range (厚度範圍) mm |
0.6~7.0 | 0.6~8.0 | 0.6~8.0 | 1.0~10.0 | 1.0~10.0 | 1.0~10.0 | ASTM D374 |
| Thermal Conductivity (導熱係數) W/m.K |
13 | 11 | 8 | 6 | 4.5 | 3.2 | ASTM D5470 |
| 8.5 | 7.5 | 6.5 | 5 | 3.8 | 2.9 | ISO22007-2 | |
| Hardness (硬度) (Shore 00) |
60 | 55 | 50 | 40 | 35 | 40 | ASTM D2240 |
| Specific Gravity (比重) g/cm³ |
3.6 | 3.5 | 3.4 | 3.3 | 3.1 | 3.0 | ASTM D792 |
| Elongation (伸張度) % |
30 | 35 | 40 | 50 | 60 | 65 | ASTM D412 |
| Tensile Strength (抗拉強度) Kgf/cm² |
0.70 | 0.75 | 0.85 | 1.20 | 2.00 | 2.00 | ASTM D412 |
| Low Molecular Siloxane D3 to D20 Total (低分子矽氧烷) Wt(%) |
0.018 | N.D. | N.D. | N.D. | 0.038 | N.D. | Gas Chromatography |
| Volume Resistance (體積阻抗) Ohm.cm |
> 1013 | > 1013 | > 1013 | > 1012 | > 1011 | > 1011 | ASTM D257 |
| Dielectric Breakdown Voltage (耐電壓) KV/mm |
> 8 | > 8 | > 8 | > 6 | > 6 | > 6 | ASTM D149 |
| Operating Temperature Range (操作溫度範圍) ℃ |
- 40 to +200 | － | |||||
| Flame Resistance (阻燃性) |
V-0 | UL-94 | |||||